Copper Foil 1125

Copper Foil 1125

Specification

Product Material: 1.4-mil copper foil

Adhesive: Acrylic nonconductive

For EMI shielding on a wide range of electronic applications. Easily die cut.

For EMI shielding, static charge draining when grounded. Easily die cut.

For EMI shielding, static charge draining when grounded. Easily die cut.

Specification

Product Material: 1.4 mil copper foil

Adhesive: Acrylic conductive

For EMI shielding, static charge draining when grounded. Easily die cut.

Copper Foil 1181

Copper Foil 1181

Specification

Product Material: 1.4 mil copper foil

Adhesive: Acrylic conductive

For EMI shielding, static charge draining, grounding. Easily die cut.

Copper Foil 1182

Copper Foil 1182

Specification

Product Material: 1.4-mil copper foil

Adhesive: Acrylic conductive coated on both sides

Typically used to bond two surfaces, both physically and electrically. Also provides EMI shielding, static charge draining, grounding.

Copper Foil 1183

Copper Foil 1183

Specification

Product Material: 1.4-mil tin-plated copper foil

Adhesive: Acrylic conductive

Oxidation resistant for long-term EMI shielding, static charge draining, grounding. Solderable &easily die cut.

Copper Foil 1194

Copper Foil 1194

Specification

Product Material: 1.4 mil copper foil

Adhesive: Acrylic nonconductive

For EMI shielding, static charge draining, grounding. Easily die cut.

Copper Foil CU-35C

Copper Foil CU-35C

Specification

Product Material: 1.4 mil copper foil

Adhesive: Acrylic conductive

For grounding and EMI shielding. Solderable and easily die cut.

Embossed Foil 1345

Embossed Foil 1345

Specification

Product Material: Embossed tin-plated copper foil

Adhesive: Acrylic nonconductive

Oxidation resistant for long-term EMI shielding, static charge draining, grounding. Solderable, easily die cut.